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Job Information
Job title

Senior Electronics Packaging Engineer

Company Cross Match Technologies
Wage Not specified
Location United States, Florida, West Palm Beach
Employment type Full Time
Education Bachelor
Year Experience 3 - 4 Years of Practical Experience
Travel None
Published on 4/17/2006
Description
Job Title: Senior Electronics Packaging Engineer
Location: Palm Beach Gardens

Position Status: Full-time Experienced

Education: BS Mechanical Engineering or Material Science (MS Preferred)

Experience: 5 Years Advanced Packaging Design and Manufacturing



Responsibilities Design and develop high performance IC packages in wire bond as well as flip chip technologies. Develop and manage all new advanced polymer packaging design techniques compatible with existing industry process and assembly methods. Work with offshore assembly location staff to support manufacturing processes and help troubleshoot problems. Manage package material selection as well as thermal and electrical characterization. Provide Technical support to Design Engineers as Business Managers for Product-package definition and cost analysis. Work with Quality Assurance, Assembly subcontractors, Test Production Control and customers to resolve technical issues. Drive cost reduction/second source programs.

Skills Position requires BS or MS in Mechanical Engineering or Material Science. Minimum 5 years experience with direct design, integration, supplier section and ramp-up of advanced electronic flip chip and wire bond packages. Strong knowledge of IC packaging materials, processes and design rules and deep understanding of offshore IC manufacturing technology and capability. Knowledge of SPC, package characterization techniques and DOE methodology. Strong analytical and problem solving skills. Excellent verbal and written communications skills. Good office software skills along with AUTOCAD required. Travel to Asia required.

Education Minimum BS Mechanical Engineer or Materials Science (MS preferred) with background in advanced materials and packaging systems.

NO PHONE CALLS PLEASE. Preferred resume submission method is through our web site .

Cross Match Technologies is an Equal Employment Opportunities Employer and follows a federally mandated Affirmative Action Plan. We encourage female, minority, and veteran applicants.df-tc

Experience/Skills
See above

Other desired skills:
Senior Electronics Packaging Engineer
This job has expired.